Package Mechanical and Simulation Engineer

3 - 6 Years
Not Disclosed by Recruiter

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Posted: 18 days agoOpenings: 1Job Applicants: 185Job Views: 726

Job Description

Package Mechanical and Simulation Engineer
Job Description

Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to collaborate with a team of industry experts to create products that impact billions of people? We are looking for a hardworking Semiconductor Packaging simulation expert to join our global team.

As a Simulation Engineer at Micron Technology, Inc. you will work in Package design and development group on thermal/mechanical simulations for advanced semiconductor packaging. In this position, you will be responsible for influencing mechanical and thermal package designs, and fostering the technology of semiconductor packaging. The scope is to address all mechanical and thermal aspects of packaging technology and associated material and process interactions. Focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. Candidate will be responsible for the modeling and characterization of mechanical and thermal response of the IC package using analysis and measurement techniques. This position will collaborate with package design, electrical and physical characterization, assembly R&D and other process module teams.

Job Description


  • Provide thermo-mechanical simulation reports to support pathfinding efforts, technology development, and product introduction
  • Guide test vehicle development to improve simulation correlation to empirical data
  • Provide recommendations to meet product requirements

Successful Candidates Must Have
  • Solid knowledge through coursework, or experience required, in thermo-mechanical multi-physics modeling and measurements of IC packaging and related areas.
  • A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
  • Detailed knowledge of material properties and material property test methods.
  • Working knowledge through academic coursework or experience in numerical simulation of material and structural behavior (non-linear deformation, viscous behavior, etc.).

Working knowledge in applying Finite Element Modeling (FEM) and/or Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as ANSYS, Abaqus, FloTHERM, and IcePak.

  • A good understanding of semiconductor packaging processes and materials and technology and trends such as; organic substrate properties, over molding materials and properties, wire-bonding materials and methods, C4 or Cu Pillar attachment methods, etc.
  • Strong oral and written communication skills.
  • Ability to work in a team environment and get along with other specialists to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.

Degree Required
  • MS or PhD


  • Mechanical Engineering, Materials Engineering, Physics, or related discipline.

Salary: Not Disclosed by Recruiter

Industry:Semiconductors / Electronics

Functional Area:Engineering Design, R&D

Role Category:Engineering Design

Role:Design Engineer

Employment Type:Full Time, Permanent


Desired Candidate Profile

Please refer to the Job description above


PG:MS/M.Sc(Science) - Mechanical Engineering, Physics

Doctorate:Ph.D - Physics, Mechanical

Company Profile

Micron Technology Operations India LLP

Micron Technology Operations India LLP
View Contact Details+

Recruiter Name:HR

Contact Company:Micron Technology Operations India LLP

Reference Id:152082